Resolved manufacturing and design problems for telecom microelectronics
resulting in cost savings, increased production yields and timely delivery
of product. Introduced advanced electronic packaging for high density RF and
milliwave electronics.

Implemented automated assembly processes for the production of electronics
used in commercial and military programs involving: pick & place automation
and PWB automated surface mount assembly; flip-chip attach; wire bonding,
metallization, soldering and plating issues; fatigue and thermal/mechanical stress
survivability analysis; cleaning processes; adhesive and polymer applications;
subcontractor support and quality control.

Designed automotive electronic packaging used on General Motors Cadillac
production line.

Pioneered development of low-cost sensor technologies for product
commercialization in real-time detection of chemical and biological agents.

Expanded details available upon request.