ARTICLES/PRESENTATIONS

Optical Coupling to IC Chip, US Patent 7,298,941 Palen et al.

Surface Mount Optical Interconnects
presented at Photonics West 2008, Paper 6899-9

Low-cost Optical Interconnects in SMT
published in the SMT Journal, October 2007.

Low Cost Optical Interconnects
presented at Photonics West 2007, San Jose, CA, January 2007

Optical Coupling to Monolithic Integrated Photonic Circuits
presented at Photonics West 2007, San Jose, January 2007

Convergence Challenges of Photonics with Electronics
presented at IEEE Components, Packaging, and Manufacturing Technology Society (CPMT)
Santa Clara Valley Chapter, October 11, 2006

Diamond Heat Spreaders Maximize Emitter Power and Lifetime
published in Laser Focus World, May 2006.

DiaTherm Low Cost CVD Diamond Heat-Spreaders
application note for sp3 Diamond Technologies, Presented at Photonics West 2006

Taking a Photonic Device from Prototype to Manufacturing:
10 Common Pitfalls and How to Avoid Them
presented at IEEE's Photonic Devices & Systems Packaging Symposium (PhoPack) 2002.

Market Pull vs. Technology Push:
Trends In Photonic Device Packaging & Automated Assembly After The Bubble
presented at Fiberoptic Automation EXPO 2002.

Laser-weld Attachment Enables Repeatable Submicron Precision
published in the Optical Manufacturing Journal 2002.

A Silver Bullet: Impact Mount Technology, published in the MEPTEC Report 2002.

Change is the Arena of Opportunity:
A Look at Photonic Devices Following the Telecommunications Bubble Burst
published in the MEPTEC Report 2002.

Why Outsource Optoelectronics Manufacturing? published in the MEPTEC Report 2001.

Challenges in Optoelectronic Packaging, presented at IMAPS-UK 2000.

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